Automated Optical Inspection

3D Solder Paste Inspection – Ultra SPI

MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as small as 01005 and Micro-BGA.

In addition MVP’s latest SPI solutions provide support for Dual Lane, Multiple Panel Inspection and microelectronics as well as full SPC reporting and data outputs.

Key Features

  • Full Solder Paste Inspection (SPI)
  • MVP Gerber Import Software Tools
  • Fastest Programming
  • Accurate Defect Identification
  • Ultimate Flexibility
  • Accurate Height Measurement for SMT and Microelectronics Processes
  • SPC Reporting and Data Outputs

Options

  • Dual Lane
  • AutoWidth
  • 3 Stage Conveyor
  • Dual Lane
  • Top Side Reference Board Lifter