Automated Optical Inspection

BGA, Bump and Package Inspection – 850 XB

MVP’s 850 XB, BGA, Bump and Package AOI inspection system provides the capabilities you need for complete measurement and defect detection. The 850 XB uses flying inspection technology to provide in-tray inspection rather than the movement of the part in the inspection bay, increasing throughput and reducing handling.

MVP’s ePro software provides users with the fastest generation of inspection databases using unique and innovative ease of use tools. Full inspection programs can be created rapidly for new products.

BGA Capabilities

Key Features

  • 2D and 3D inspection
  • Combinational ball and substrate inspection
  • Ball Diameter, Shape, Offsets and Damage
  • Coplanarity and Height Measurements
  • Bridging, Missing Balls
  • Foreign Materials and Substrate Damage
  • Integrated Jedec Tray Handlers

Options

  • AutoNetworker Option for Web Reports for BGA Process