Automated Optical Inspection

Post Inspection Options – 2020 DWMS

The MVP 2020 DWMS can be configured to host a wide selection of post AOI inspection defect identification options.

MVP support inline or offline review and repair, ink stamping, wire cutting and punch out of defective devices. In addition MVP also provide capability to communicate XML defect maps to downstream processes.

InkerInk Marking Module

Ink Marking is available as a post inspection or inline option on the DPMS platform. The inline option mounts the inker directly to the moving stage of the AOI machine marking post inspection.

For the inline option the ink marker is mounted within it's own dedicated module and works in parallel with the inspection cycle times removing any impact to UPH.


puncherPuncher Module

The puncher is available as a post inspection inline option on the DPMS platform. The puncher module acts to physically punch out a section of the device rendering as an electrical fail at upstream processes.

The puncher marker is mounted within it’s own dedicated module and works in parallel with the inspection cycle times removing any impact to UPH.


ripperWire Ripper Module

Wire ripping is available as a post inspection or inline option on the DPMS platform. The inline option mounts the wire ripper directly to the moving stage of the AOI machine and then performing the rip post inspection.

For the inline option the wire ripper is mounted within it’s own dedicated module and works in parallel with the inspection cycletimes removing any impact to UPH.


LeadframeMappingXML Mapping

XML maps are a standard option provided on the 850 DWMS. Handshaking with upstream processes the XML maps share defect pass/fail data with any upstream process to including a variety of markers, encapsulators to ensure that defective devices remain unprocessed and fail all upstream tests.