Automated Optical Inspection

Microelectonics and Packaging

Clean Room AOI – 850 CL

The MVP 850 CL AOI is designed for clean room operation. Designed for laminar air flow environments the 850 CL is open top and designed to allow laminer air flow through the machine body. The 850 CL is designed to operate in clean rooms down to Class 100. The 850 CL can be configured for […]

Post Inspection Options – 2020 DWMS

The MVP 2020 DWMS can be configured to host a wide selection of post AOI inspection defect identification options. MVP support inline or offline review and repair, ink stamping, wire cutting and punch out of defective devices. In addition MVP also provide capability to communicate XML defect maps to downstream processes.

Metrology AOI – 850 XHD

MVP’s 850 XHD solution provide the highest accuracy flip-chip Die assembly inspection. MVP’s high performance inspection technology ensures the correct placement of the Die on the substrate, while providing edge, FM and surface inspection. Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring […]

BGA, Bump and Package Inspection – 850 XB

MVP’s 850 XB, BGA, Bump and Package AOI inspection system provides the capabilities you need for complete measurement and defect detection. The 850 XB uses flying inspection technology to provide in-tray inspection rather than the movement of the part in the inspection bay, increasing throughput and reducing handling. MVP’s ePro software provides users with the […]

Lead Frame Inspection – 2020 DWMS

MVP’s 2020 DWMS (Die Wire Metrology System) is a new dedicated lead frame inspection AOI and uses advanced optic and handling solutions to provide the latest in Die and Wire-Bond inspection. Inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Lead Frame, Die Epoxy, […]

Die and Wire Bond Inspection – MVP 850G

MVP’s 850G inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Die and Wire Bond inspection. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies. MVP also provide many material handling configurations for the 850G AOI […]