Automated Optical Inspection

BGA Inspection

BGA, Bump and Package Inspection – 850 XB

MVP’s 850 XB, BGA, Bump and Package AOI inspection system provides the capabilities you need for complete measurement and defect detection. The 850 XB uses flying inspection technology to provide in-tray inspection rather than the movement of the part in the inspection bay, increasing throughput and reducing handling. MVP’s ePro software provides users with the […]