Automated Optical Inspection

Die and Wire Bond

Die and Wire Bond Inspection – MVP 850G

MVP’s 850G inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Die and Wire Bond inspection. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies. MVP also provide many material handling configurations for the 850G AOI […]