Automated Optical Inspection

Metrology AOI – 850 XHD

MVP’s 850 XHD solution provide the highest accuracy flip-chip Die assembly inspection. MVP’s high performance inspection technology ensures the correct placement of the Die on the substrate, while providing edge, FM and surface inspection. Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring […]

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Lead Frame Inspection – 2020 DWMS

MVP’s 2020 DWMS (Die Wire Metrology System) is a new dedicated lead frame inspection AOI and uses advanced optic and handling solutions to provide the latest in Die and Wire-Bond inspection. Inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Lead Frame, Die Epoxy, […]

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