Semiconductor Packaging Solutions – Component Inspection

The Ultra 850XB package inspection system provides the capabilities you need for complete BGA package inspection. MVP provide a range of advanced optics, 3D measurement capabilities and handling solutions to meet your manufacturing requirements.

The Ultra 850XB using flying inspection technology to provide in-tray inspection rather than the movement of the part in the inspection bay, increasing throughput and reducing handling.

The system provides the following capabilities: 

Coplanarity and Height Measurements
Ball Diameter, Shape and Damage
Offsets
Bridging
Missing Balls
Substrate Damage

   
Component Inspection



850G
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