The 850Gs Combined 2D and 3D capabilities allow for high accuracy component metrology and inspection at the highest UPHs.

MVP provide BGA, leaded, Die and Custom component inspection capabilities including co-planarity, ball heights, offsets, dimensions, part marking and substrate damage.

Standard and Custom handling solutions are provided and include, tray handling, magazine handling, strip handling, in-line operation, custom handling requirements and part disposition solutions.

BGA Co-Planarity Ball Shape and Dimensions Bump Inspection Lead Inspection Part Markings Offsets Part Dimensions Substrate Damage

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