MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection.

Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850G can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed die placement metrology.