Semiconductor Packaging Solutions – Material Inspection

The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.

The 850G 3D Paste capabilities allow for in-line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

For Epoxy and Underfill inspection the 850G provides full in-line inspection capability. The unique capabilities of the system allow for the following measurements; Epoxy Boundary (Flow and spread), Epoxy Fillet (Quality and defects), and Excess Epoxy (anywhere in the inspection area).



 
850G Bottom_Btn_Info