The 850G provides full in-line inspection capability for C4 Epoxy Underfill. The unique capabilities of the system allow for all Underfill test and measurement requirements to ensure the reliability of the semi-conductor package in the field.

• Epoxy Boundary (Flow and spread) • Epoxy Fillet (Quality and defects) • Excess Epoxy (anywhere in the inspection area) • Pre and Post Epoxy Cure

Under Fill Inspection