The 850Gs Combined 2D and 3D along with its 1um resolution option allow for complete wire bond and wire inspection. MVP’s proprietary algorithms use multi‐registration techniques to accommodate for bond and die movement, to allow complete wire and bond inspection across different substrates and dies.

• Substrate and Die Registration • Shoe/Bond Measurement, Foot Shape and Tool Mark • Trace Wire – Continuity • Straightness • Loop Hot Spots • Wire Position • Works with all Bond Styles • Resolutions to 1um

Wirebond Examples