Semiconductor Packaging Solutions – Wire Bond Inspection

If Wire bonds are also used in your packaging process the 850G provides the capabilities to ensure correct
connectivity, not just missing of all gold and aluminum wires bonds. Capabilities include:

• Substrate and Die Registration
• Shoe/Bond Measurement, Foot Shape and Tool Mark
• Trace Wire – Continuity
• Straightness
• Loop Hot Spots
• Wire Position
• Works with all Bond Styles
• Resolutions to 1um
Wire Bond

Wirebond Examples
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