Automated Optical Inspection


What you need to know before buying your AOI solution

When defining an inspection strategy for your manufacturing processes there are many factors that need to be considered. As well there are many products that seem to have solutions to your inspection requirements, how do you make the decision of which system to use? How do you determine the viability of manual inspection, of template/comparative vs. measurement based AOI, what resolution to use, which cameras, what data outputs are required, do you need measurement data, attribute data or both.

Optimized Strategies to Reduce the Cost of Test and Inspection While Increasing Manufacturing Quality

In the current economic environment optimizing manufacturing costs, and especially Test and Inspection costs are high on most companies agendas. But we still need to ensure the highest level of quality for customer shipments. Both cost and quality goals can be achieved by carefully selecting the test and inspection strategy used in manufacturing. Understanding the benefits and defect coverage provided by the many solutions is key to achieving the highest quality at the lowest costs.

Measurement and Inspection Applications in Packaging

Last year MVP introduced yet another innovative line of products which has revolutionized the AOI technology in several electronics industry sectors. Targeted towards packaging applications, the new platform was designed to meet and exceed today’s complex High Volume Manufacturing assembly requirements. The configurable nature of the platform makes it a perfect high speed AOI choice for many applications in complex and hybrid C4 + SMT assembly lines.

Inspecting Post Wire-bond Interconnects: An AOI Approach

There is an urgent need today for an efficient and reliable method of inspection that is effective, safe, dependable, measurement-driven, capable of inspecting all wire-bond failure modes, versatile enough to include measurement and inspection of other electronic components, and fast enough to keep up with the production while inspecting 100% of the products.The question naturally arises: can AOI technology provide a basis to meet the stiff demands for post-wire-bond inspection? The answer to this question is “yes.”

Flux Inspection with UV Fluorescence AOI: Making the invisible visible

Flux inspection has been a challenge for Flip Chip and BGA assemblers due to the inability of inspection systems, including AOI (Automated Optical Inspection), to accurately see the material and therefore be able to inspect it while maintaining line speed. Specifically with respect to flip chips, the inspection of flux is an important part of controlling the process and can prevent costly mistakes from happening. Fortunately, a machine vision solution utilizing UV (Ultra Violet) illumination, which has been developed over many years of research, is able to detect defects from flux deposits. This technique, which has now proven successful for more than three years on high volume manufacturing lines, replaces the visible AOI light with specialized UV light that matches the properties of the substrate and flux, in order to achieve optimized inspection results.

Real-time SPC with AOI

Throughout electronics manufacturing, SPC has been implemented with overall success. Quality generally has improved while the level of accountability has risen as data (some of which having been collected by automated optical inspection [AOI] systems) are on hand to monitor defects and to indicate less than optimum system performance. However, an inherent flaw in the general use of SPC exists: the data are not real time. Typically, the information is analyzed, line problems are discovered and changes made – a process that is hours and sometimes days after the fact. During the time between identifying the fault and correcting it, thousands of imperfect boards may have been produced at high cost and rising scrap levels.