Automated Optical Inspection

Ultra SPI

3D Solder Paste Inspection – Ultra SPI

MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as small as 01005 and Micro-BGA. In addition MVP’s latest SPI solutions provide support for Dual Lane, Multiple Panel Inspection […]